Treatment for copper foil

Details Treatment for copper foil Treatment for copper foil

C - Chemistry, Metallurgy

25

D

204/25.5

C25D 5/10 (2006.01) C25D 3/56 (2006.01) C25D 5/16 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1277948

ABSTRACT OF THE DISCLOSURE An improved treatment for copper foil that is to be used for lamination to a board comprises electrodepositing a dendritic layer of copper on the side of the foil that is to be laminated to the board. The dendritic layer is secured by electrodepositing a gilding layer of copper over it. A barrier layer is next electrodeposited over the gilding layer. The barrier layer is formed by means such as electrodeposition from a solution containing ions of zinc, nickel and antimony. This in turn is covered with an anticorrosion layer that is formed of chromates or phosphates, disposed over the barrier layer.

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