Treatment of drilled copper clad thermoplastic laminates...

Details Treatment of drilled copper clad thermoplastic laminates... Treatment of drilled copper clad thermoplastic laminates...

H - Electricity

05

K

149/14

H05K 3/26 (2006.01) C23C 18/24 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1267350

TREATMENT OF COPPER CLAD THERMOPLASTIC LAMINATES USING CONCENTRATE SULFURIC ACID Abstract of the Disclosure Copper clad thermoplastic laminates having holes drilled therein may be treated to render the hole walls thereof adherently electrolessly platable by immersing the laminate in concentrated sulfuric acid, optionally containing an oxidizing agent, and then removing sulfuric acid from the laminate thus treated. As oxidizing agent, ammonium persulfate is preferred. S P E C I F I C A T I O N

516551

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