C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 27/04 (2006.01) B22F 1/02 (2006.01) B22F 9/22 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) C22C 1/04 (2006.01) C22C 29/12 (2006.01) H01H 1/025 (2006.01) H01L 23/498 (2006.01) H05K 1/09 (2006.01)
Patent
CA 2190550
A high performance W-Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten- coated copper composite powder may be pressed and sintered into W-Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
Dorfman Leonid P.
Houck David L.
Meyers Gail T.
Paliwal Muktesh
Scheithauer Michael J.
Global Tungsten & Powders Corp.
Osram Sylvania Inc.
R. William Wray & Associates
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