Two pack type curable composition comprising epoxy resin and...

C - Chemistry – Metallurgy – 08 – L

Patent

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400/5302, 400/53

C08L 83/00 (2006.01) C08L 63/00 (2006.01) C08L 63/02 (2006.01) C08L 63/04 (2006.01)

Patent

CA 2003980

- 34 - ABSTRACT OF THE DISCLOSURE A two-pack type curable composition comprising: A. a first composition containing (A-1) an organic elastomeric polymer having at least one silicon-containing group to the silicon atom of which a hydroxyl group and/or a hydrolyzable group are bonded and which is cross linkable through formation of a siloxane linkage in a molecule and (A-2) a curing agent for an epoxy resin, and B. a second composition containing (B-1) an epoxy resin, (B-2) a curing catalyst for the organic elastomeric polymer having at least one silicon-containing reactive group and (B-3) at least one member selected from the group consisting of acidic fillers and carboxylic acids, which has good storage stability.

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