C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/5340
C08L 63/00 (2006.01) C08G 59/68 (2006.01) C08K 5/57 (2006.01) C08L 43/04 (2006.01) C08L 83/04 (2006.01) C08L 83/06 (2006.01) C08L 101/10 (2006.01)
Patent
CA 2003506
- 30 - ABSTRACT OF THE DISCLOSURE A two pack type curable composition comprising: A. a first liquid containing an organic elasto- meric polymer having at least one silicon-containing reac- tive group in a molecule and a curing agent for an epoxy resin, and B. a second liquid containing an epoxy resin, at least one organic tin compound selected from the group con- sisting of compounds of the formulae: 2?Sn(OCOR2)2 (I) and Image (II) wherein R1 is a monovalent hydrocarbon group, and R2 is a monovalent aliphatic hydrocarbon group having 7 to 19 carbon atoms, and an inorganic filler, which composition has good storage stability.
Homma Michihide
Isayama Katsuhiko
Wakabayashi Hiroshi
Yoshihara Atsuko
Kanegafuchi Chemical Industry Co. Ltd.
Kirby Eades Gale Baker
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