Two-part curable polymeric system

Details Two-part curable polymeric system Two-part curable polymeric system

C - Chemistry, Metallurgy

08

L

400/1, 400/4014,

C08L 55/02 (2006.01) C08L 33/00 (2006.01) C09J 4/06 (2006.01)

Patent

CA 1246772

ABSTRACT Two component curing adhesive compositions comprise a) a binder component comprising a polymerisable vinyl monomer, an organic acid, a peroxy polymerisation initiator and a high molecular weight polymer, and b) a hardener component comprising a polymerisable vinyl monomer, a thione polymerisation accelerator and a high molecular weight polymer.

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