Two-part, two-tier cure adhesive composition

Details Two-part, two-tier cure adhesive composition Two-part, two-tier cure adhesive composition

C - Chemistry, Metallurgy

09

J

402/125, 402/247

C09J 5/04 (2006.01) C08L 71/02 (2006.01) C08L 101/06 (2006.01) C09D 4/06 (2006.01) C09J 4/00 (2006.01)

Patent

CA 1234249

TWO-PART, TWO-TIER CURE ADHESIVE COMPOSITION ABSTRACT OF THE DISCLOSURE A two-part composition comprising as a first part a polymerizable vinyl-type material and a free-radical polymerization system comprising at least one aromatic acyl peroxide and a compound selected from the group consisting of peroxides, hydroperoxides, peresters, persalts and peracids, exclusive of aromatic acyl peroxides; and as a second part a polymerizable vinyl-type material and an accelerator system comprising an amine and optionally either a sulfimide, an hydrazine derivative, or both. The resin systems of each part are substantially similar in rheology and viscosity to optimize the effectiveness of the adhesive composition. The composition combines anaerobic-type cure systems to obtain excellent cure through volume (CTV). The non-anaerobic-type cure system allows for the superior CTV capability over the prior art and is not dependent on metal ion catalysis for cure accleration, making the composition particularly useful on inactive surfaces such as plastics or aluminum.

417418

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