C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/134
C25D 5/08 (2006.01) C25D 7/10 (2006.01)
Patent
CA 1175778
Ultra-High Current Density Electroplating Cell Abstract of the Disclosure The electroplating cell includes a reservoir of electroplating solution into which a workpiece supporting and locating structure is able to be lowered. The workpiece supporting structure supports and locates a plurality of semi-cylindrical bearing elements in a column around a cylindrical anode structure. A plating cavity is defined between the bearing elements and the anode structure. The anode structure includes a tubular anode basket having a plurality of apertures therein and a woven liner along its interior. A copper rod is attached to the anode basket and extends along its central axis for supplying electrical potential to pellets of the plating metal disposed within the anode basket and for rotating the anode basket. A plurality of vanes are attached to the exterior of the anode basket for rotation through the plating cavity to stir the plating solution. A first pump circulates plating solution from the reservoir into the plating cavity at a rate of about 20 to 60 gallons per minute and a second pump draws plating solution out of the anode basket at a rate of less than 10 gallons per minute. The remaining solution escapes from the top of the plating cavity and returns to the plating reservoir.
405709
Green Ralph R.
Kruper Wayne A.
Imperial Clevite Inc.
Marcoux & Sher Swabey Mitchell Houle
LandOfFree
Ultra-high current density electroplating cell does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultra-high current density electroplating cell, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultra-high current density electroplating cell will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1258666