Ultra high-frequency circuit

Details Ultra high-frequency circuit Ultra high-frequency circuit

H - Electricity

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H01L 25/16 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 3/40 (2006.01) H05K 1/02 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1184317

ABSTRACT: an ultra-high-frequency circuit realized on an insulating aluminiumoxide substrate according to hybrid technology and by silk screen printing. Silver-palladium is used for the mass surface instead of gold of the prior art circuits. The connection between the conductive gold tracks of the circuit and the mass surface of silver- palladium through the metallized holes is ensured by the intertposition of a gold-platinum alloy metallization. The gold-platinum alloy interconnection is necessary in order to obtain a stable configuration. avoiding migra- tion of silver into the gold of the circuit. The new configuration provides a considerable reduction of cost with respect to an assembly with total metal appliance of gold.

401423

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