Ultra low melt metal nanoparticle composition for thick-film...

Details Ultra low melt metal nanoparticle composition for thick-film... Ultra low melt metal nanoparticle composition for thick-film...

C - Chemistry, Metallurgy

09

D

C09D 5/24 (2006.01) C09D 7/12 (2006.01) C09D 201/00 (2006.01) H01L 21/3205 (2006.01)

Patent

CA 2722639

A method of forming conductive features on a substrate, the method includes reacting a metal compound with a reducing agent in the presence of a stabilizer in a reaction mixture comprising the metal compound, the reducing agent, and the stabilizer, wherein the reaction mixture is substantially free of solvent, to form a plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles. After isolating the plurality of metal nanoparticles, a liquid composition that includes a polymeric binder, a liquid and the plurality of metal nanoparticles with molecules of the stabilizer on the surface of the metal nanoparticles is deposited on a substrate by a liquid deposition technique to form a deposited composition. The deposited composition is then heated to form conductive features on the substrate.

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