Ultra-tall indium or alloy bump array for ir detector...

Details Ultra-tall indium or alloy bump array for ir detector... Ultra-tall indium or alloy bump array for ir detector...

G - Physics

01

J

340/155.2

G01J 1/02 (2006.01) H01L 21/98 (2006.01) H01L 23/485 (2006.01) H01L 27/146 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2017743

Method for improving particular interconnect pads for microcircuitry so that they provide more compliant interconnections between opposed pairs of contacts of the microchips in a hybrid detector array assembly. The individual tubes of prior art interconnect pads are filled with indium and are then etched away to leave indium columns of increased height, relative to the indium bumps that have heretofore been used in the contact connections of hybrid detector array assemblies. Other materials may be substituted for the indium and a number of variants of the process are also disclosed.

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