Ultrahigh molecular weight polyethylene composite for...

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B - Operations, Transporting

32

B

B32B 27/00 (2006.01) B32B 27/02 (2006.01) B32B 27/12 (2006.01) C08J 5/04 (2006.01) D03D 3/00 (2006.01) D03D 15/00 (2006.01) D03D 17/00 (2006.01) D03D 25/00 (2006.01) H05K 1/00 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2313459

An ultrahigh molecular weight polyethylene (UHMWPE) composite (12) for use in printed circuit board or antenna base material. A base material includes at least one dielectric layer which comprises of an ultrahigh molecular weight polyethylene composite (12) and at least one electroconductive layer (16) which comprises of an electroconductive material; the dielectric and electroconductive layers being intimately bonded to one another.

La présente invention concerne un composite en polyéthylène de poids moléculaire très élevé (UHMWPE) (12) destiné à être utilisé dans des plaquettes de circuits imprimés ou des matériaux de base pour antennes. Un matériau de base comprend au moins une couche diélectrique contenant un composite en polyéthylène de poids moléculaire très élevé (12), et au moins une couche électroconductrice (16) comprenant un matériau électroconducteur. Les couches diélectrique et électroconductrice sont par ailleurs intimement fixées ensemble.

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