Ultrasonic removal of contaminants from boreholes of printed...

H - Electricity – 05 – K

Patent

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149/18, 356/20

H05K 3/26 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1307353

ABSTRACT OF THE DISCLOSURE The present invention relates to a process for the removal of contaminants from holes of printed circuit boards using oxidants, such as permanganates in aqueous solutions, and/or swelling (soaking) agents as well as employing an ultransonic treatment wherein the boards are passed horizontally during the treatment.

551556

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