Ultrasonic welding of resilient layers to plates

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 65/08 (2006.01) B29C 65/02 (2006.01) B29C 65/16 (2006.01) B32B 27/32 (2006.01)

Patent

CA 2514032

This invention relates to methods for manufacturing plates bonded to resilient layers, wherein the plate is made of a polypropylene and the resilient layer is made of a polyethylene. Ultrasonic welding used to bond the resilient layer to the plate. In some embodiments, a thin film is applied to a layer of the resilient layer before ultrasonic welding. While the film layer may be located adjacent the plate when welding, the film layer may also be advantageously located on the opposite of the resilient layer from the plate when welding. The film may also be applied to both sides of the resilient layer.

L'invention concerne des procédés de production de plaques liées à des couches résilientes, la plaque étant constituée de polypropylène et la couche résiliente de polyéthylène. Le soudage ultrasonique permet de lier la couche résiliente à la plaque. Dans certaines modes de réalisation, un mince film est appliqué sur une couche de la couche résiliente avant le soudage ultrasonique. Tandis que la couche de film peur être adjacente à la plaque lors du soudage, elle peut aussi avantageusement être située sur le côté opposé de la couche résiliente de la plaque lors du soudage. Le film peut aussi être appliqué des deux côtés de la couche résiliente.

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