Ultrasonically assisted plating bath for vias metallization...

Details Ultrasonically assisted plating bath for vias metallization... Ultrasonically assisted plating bath for vias metallization...

H - Electricity

05

K

H05K 3/42 (2006.01) C25D 5/20 (2006.01) C25D 7/12 (2006.01) C25D 21/12 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2317233

A method and apparatus for enhancing the microthrowing power in a plating bath. The method involves the use of ultrasonic vibration of an electrochemical solution to increase the uniformity of copper deposition for blind hole vias. The apparatus includes a series of ultrasonic transducers positioned between anodes for vibration of the solution being electro deposited on the cathode.

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