Ultrasonically bondable polyphenylene ether compositions

Details Ultrasonically bondable polyphenylene ether compositions Ultrasonically bondable polyphenylene ether compositions

C - Chemistry, Metallurgy

08

L

400/3040, 400/48

C08L 25/04 (2006.01) C08J 5/12 (2006.01) C08L 51/04 (2006.01) C08L 53/02 (2006.01) C08L 71/12 (2006.01) C08L 69/00 (2006.01)

Patent

CA 1134531

8 CH 2335 ABSTRACT OF THE DISCLOSURE Thermoplastic polyphenylene ether molding compositions are provided which, after molding, are ultrasonically bondable to acrylic or to polycarbonate poly- mers with improved bond strength, the compositions comprising an admixture of a polyphenylene ether resin, a styrene resin and at least 40 parts by weight of a polymeric material which is polar in relation to the styrene resin, based on 100 parts by weight of said polyphenylene ether resin and said styrene resin. Especially suitable for such polymeric materials are copolymers of styrene and maleic anhydride; copolymers of styrene and methyl methacrylate and terpolymers of styrene, maleic anhydride and a diene. Optionally, an A-B-A block copolymer, e. g., a styrene-butadiene-styrene resin, can also be included in the compositions.

292811

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