C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
117/192, 400/402
C09D 5/25 (2006.01) B32B 15/02 (2006.01) C08F 299/02 (2006.01)
Patent
CA 1171583
27 48,960 ABSTRACT OF THE DISCLOSURE Disclosed is a wire enamel blend which is cur- able to the B-stage with UV light then to the C stage with heat. The blend comprises up to about 40% of an acrylated epoxy dissolved in a monoacrylate, about 2 to about 26% of an acrylated polybutadiene, about 3 to about 26% of an acrylated polyester-amide-imide dissolved in a mono- acrylate and in an unsatured diester, about 30 to about 65% of an end-blocked urethane dissolved in a monoacrylate and hydroxy terminated unsaturated diesters, up to about 15% of a cresol formaldehyde dissolved in monoacrylates, about 1.5 to about 5% of a UV photoinitiator, up to about 5% of an acrylated cymel?, up to about .1% of a flow control agent.
379824
Oldham And Company
Westinghouse Electric Corporation
LandOfFree
Ultraviolet curable solvent-free wire enamel blends does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ultraviolet curable solvent-free wire enamel blends, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ultraviolet curable solvent-free wire enamel blends will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1172696