Ultraviolet (uv) and plasma assisted metalorganic chemical...

C - Chemistry – Metallurgy – 23 – C

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C23C 16/48 (2006.01) B05D 5/12 (2006.01) H01B 13/008 (2006.01) H01B 12/00 (2006.01)

Patent

CA 2527732

The present invention is a high-throughput, ultraviolet (UV) assisted metalorganic chemical vapor deposition (MOCVD) system for the manufacture of HTS-coated tapes. The UV-assisted MOCVD system of the present invention includes a UV source that irradiates the deposition zone and improves the thin film growth rate. The MOCVD system further enhances the excitation of the precursor vapors and utilizes an atmosphere of monatomic oxygen (O) rather than the more conventional diatomic oxygen (O2) in order to optimize reaction kinetics and thereby increase the thin film growth rate. In an alternate embodiment, a microwave plasma injector is substituted for the UV source.

La présente invention concerne un système de dépôt chimique métallo-organique en phase vapeur (MOCVD) assisté par ultraviolet (UV) à haut rendement permettant de produire des bandes à revêtement HTS. Ce système MOCVD assisté par UV comprend une source d'UV qui irradie la zone de dépôt et améliore la vitesse de croissance de couche mince. Le système MOCVD améliore également l'excitation des vapeurs de précurseur et utilise une atmosphère d'oxygène monoatomique (O), au lieu de l'oxygène diatomique (O¿2?) plus classique, afin d'optimiser la cinétique de la réaction et donc d'améliorer la vitesse de croissance de couche mince. Dans un autre mode de réalisation, un injecteur de plasma micro-ondes remplace la source d'UV.

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