C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
117/184, 400/530
C08G 65/32 (2006.01) C08G 77/42 (2006.01) C08G 77/50 (2006.01) C08G 85/00 (2006.01) C09D 157/06 (2006.01) C09D 201/02 (2006.01)
Patent
CA 1266941
Abstract of the Disclosure Disclosed is an ungelled resin composition comprising a compound having at least one group containing a silicon atom selected from: Image and Image wherein Q represents the residue from an organic polyol selected from the group conslsting of (1) simple diols, triols and higher hydric alcohols, (2) polyester polyols, (3) polyether polyols, (4) amide-containing polyols, (5) epoxy polyols and (6) polyhydric polyvinyl alcohols, and each R independently is selected from the group of moieties consisting of hydrogen, and a C1-C10 group joined to Si through an Si-C linkage, and Y represents an easily hydrolyzable group. The ungelled resin composition contains an amount of easily hydrolyzable Y moieties directly bonded to silicon atoms such that the ratio of the number of grams of the ungelled resin composition to equivalents of easily hydrolyzable Y moieties in the ungelled resin composition is in a range of from 40 to 667. Preferred resin compositions of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees Celsius within 3 hours. Disclosed is a method for producing the ungelled resin composition. Also disclosed is a nonaqueous composition, particularly a nonaqueous coating composition, containing an ungelled resin composition of the invention. Preferred coating compositions containing an ungelled resin composition of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees C within 3 hours.
507731
Chang Wen-Hsuan
Mckeough David T.
Borden Ladner Gervais Llp
Chang Wen-Hsuan
Mckeough David T.
Ppg Industries Inc.
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