Unique epoxy resin compositions and composite molded bodies...

H - Electricity – 01 – B

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H01B 3/40 (2006.01) C08G 59/22 (2006.01)

Patent

CA 1263496

UNIQUE EPOXY RESIN COMPOSITIONS AND COMPOSITE MOLDED BODIES FILLED THEREWITH Abstract of the Disclosure A thermosetting resin composition of an epoxy resin mixture of 1,2 epoxy resin having at least two epoxide groups per molecule and a polyglycol diepoxide having viscosity of 2,000-5,000 centipoises at 25°C and in addition small but effective amounts of both a catalytic hardener and an accelerator has special utility in the production of composite molded bodies of electrical insulation having thermoplastic shells because of its unique combination of properties including thermal stability, thermal-cycling crack resistance, high impact strength, toughness, room-temperature curability and bondability to both thermoplastic and metallic surfaces, and because it does not stress crack thermoplastic shells to which it is bonded in curing.

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