Unitary slotted heat sink for semiconductor packages

Details Unitary slotted heat sink for semiconductor packages Unitary slotted heat sink for semiconductor packages

H - Electricity

01

L

356/113

H01L 23/34 (2006.01) H01L 23/367 (2006.01) H01L 23/467 (2006.01)

Patent

CA 1204523

Unitary Slotted Heat Sink for Semiconduator Packages Abstract A unitary heat sink for a semiconductor package having a plurality of cooling fin elements, each element having upwardly extending openings that divide the base into a plurality of leg portions, the heat sink having a plurality of flat base portions individually bonded to a surface of the package, each of the leg portions of an individual fin element being integral with different but adjacent flat base portions, in operation the heat sink preventing a build-up of stresses at the bonded interface of the base portions and package due to differential coefficient of expansions of the heat sink and package.

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