Universal copper-plating solution

Details Universal copper-plating solution Universal copper-plating solution

G - Physics

03

G

6/4, 96/57

G03G 9/16 (2006.01) C23C 18/40 (2006.01) G03C 5/30 (2006.01)

Patent

CA 1052162

ABSTRACT A copper-plating bath which is suitable both for reprographic uses and for making electrically conducting metal patterns comprising a cupric salt, the redox pair Fe2+/Fe3+ and an organic phosphonic acid derivate so that the difference between the copper potential and the redex potential is at least 50 mV.

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