C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
117/184, 400/530
C08G 18/83 (2006.01) C09D 3/72 (1985.01)
Patent
CA 1266942
Abstract of the Disclosure Disclosed is an ungelled urethane resin composition containing a urethane compound having in a molecule thereof at least one group containing a silicon atom selected from: Image and Image wherein Q represents the residue from a urethane polyol; each R which may be the same or different, represents hydrogen or a C1-C10 group joined to Si through an Si-C linkage; and Y represents an easily hydrolyzable group. The urethane resin composition contains an amount of easily hydrolyzable Y moieties such that the ratio of the number of grams of the ungelled urethane resin composition to equivalents of easily hydrolyzable Y moieties in the ungelled urethane resin composition is in a range of from 40 to 667. Preferred urethane resin compositions can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of Less than or equal to 121 degrees Celsius within 3 hours. Disclosed is a method for producing the ungelled urethane resin composition. Also disclosed is a nonaqueous composition, particularly a nonaqueous coating composition, containing an ungelled urethane resin composition. Preferred coating compositions containing an ungelled urethane resin composition can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees Celsius.
507735
Ambrose Ronald Ruthvoyne
Chang Wen-Hsuan
Mckeough David Thomas
Borden Ladner Gervais Llp
Ppg Industries Inc.
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