Use of amorphous carbon to promote adhesion between...

Details Use of amorphous carbon to promote adhesion between... Use of amorphous carbon to promote adhesion between...

B - Operations, Transporting

32

B

B32B 7/04 (2006.01) B05D 5/12 (2006.01) B32B 27/06 (2006.01) C25B 11/04 (2006.01) C25D 13/20 (2006.01) G02F 1/15 (2006.01) G02F 1/155 (2006.01) H01M 4/60 (2006.01) H01M 4/66 (2006.01)

Patent

CA 2053192

An interposed layer of amorphous carbon promotes the adhesion between conductive substrates and electrochemically deposited polymers. Such a carbon layer may be deposited directly onto the conductive substrate by conventional methods such as, for example, chemical vapor deposition. The subsequently applied electrochemically deposited polymer adheres more tenaciously to the amorphous carbon coating than if it had been electrodeposited directly onto the conductive substrate.

Affiliated with

Also associated with

Rating

Use of amorphous carbon to promote adhesion between... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Use of amorphous carbon to promote adhesion between..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Use of amorphous carbon to promote adhesion between... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1940818