C - Chemistry – Metallurgy – 09 – J
Patent
C - Chemistry, Metallurgy
09
J
C09J 11/06 (2006.01) A43B 13/12 (2006.01) B32B 7/12 (2006.01) B32B 27/06 (2006.01) C09J 5/02 (2006.01) C09J 5/06 (2006.01)
Patent
CA 2723227
The present invention relates to the use of an encapsulated adhesion promoter in an effective amount in an aqueous adhesive joint, said aqueous adhesive joint being intended to bond a surface of a first substrate (S1) to a surface of a second substrate (S2), at least one of said two substrates comprising a material (TPE-PA) comprising at least one thermoplastic elastomer (TPE) and/or at least one polyamide (PA), said adhesion promoter (P) comprising at least one organic molecule having at least one isocyanate function blocked by encapsulation of said organic molecule.
La présente invention concerne l'utilisation d'un promoteur d'adhérence encapsulé en quantité efficace dans un joint de colle aqueux, ledit joint de colle aqueux étant destiné à coller une surface d'un premier substrat (S1) à une surface d'un second substrat (S2), l'un au moins desdits deux substrats comprenant un matériau (TPE-PA) comprenant au moins un élastomère thermoplastique (TPE) et/ou au moins un polyamide (PA), ledit promoteur d'adhérence (P) comprenant au moins une molécule organique comportant au moins une fonction isocyanate bloquée par encapsulation de ladite molécule organique.
D'herbecourt Bruno
Eustache Rene-Paul
Arkema France
Robic
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