Use of aqueous dispersion as heat-sealing lacquer

Details Use of aqueous dispersion as heat-sealing lacquer Use of aqueous dispersion as heat-sealing lacquer

C - Chemistry, Metallurgy

08

F

C08F 265/02 (2006.01) B05D 5/10 (2006.01) C08F 255/02 (2006.01) C09J 5/06 (2006.01) C09J 123/08 (2006.01) C09J 151/06 (2006.01)

Patent

CA 2200890

A method for heat-sealing substrates is described, which comprises coating a substrate with an aqueous dispersion comprising an ethylene polymer A), with at least 20 % by weight of ethylene and at least 5 % by weight of an ethylenically unsaturated acid, and a free-radically polymerized polymer B), and pressing the coated substrate with a second substrate at elevated temperature.

On décrit une méthode pour le thermoscellage de substrats qui comprend le revêtement d'un substrat avec une dispersion aqueuse comprenant un polymère d'éthylène A) contenant au moins 20 % en poids d'éthylène et au moins 5 % en poids d'un acide insaturé, et un polymère obtenu par polymérisation radicalaire B), et le pressage du substrat revêtu avec un second substrat à une température élevée.

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