C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 63/00 (2006.01) C09J 163/00 (2006.01)
Patent
CA 2593675
One-part epoxy adhesive formulations, and methods of using the same, are described. The formulations include, among other things, powdered methacrylate butadiene styrene and aramid pulp to, among other things, improve the wash off resistance, T peel strength, and impact strength characteristics thereof. Additionally, the formulations exhibit desirable expansion characteristics. The formulations are especially suitable for use in joining automotive components.
Formulations époxy adhésives simples, et procédés d'utilisation, ces formulations comprenant entre autres méthacrylate butadiène styrène et pâte aramide en poudre, entre autres pour améliorer la résistance au délavage, la résistance au pelage T ainsi que les caractéristiques de résistance à l'impact, et enfin ces formulations ayant des caractéristiques d'expansion souhaitables. Il s'agit de formulations spécialement appropriées à une utilisation pour l'assemblage de pièces dans l'industrie automobile.
Kye Jihong
Dow Global Technologies Inc.
Smart & Biggar
LandOfFree
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