Use of cupric chloride etchant solution in a solvent...

C - Chemistry – Metallurgy – 22 – B

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C22B 15/00 (2006.01) C22B 3/04 (2006.01) C22B 3/08 (2006.01) C22B 3/26 (2006.01)

Patent

CA 2342513

Process for improving recovery of copper and reducing raw material costs, from a copper-containing source by SX-EW. The process comprises the steps of mixing an acidic copper-containing PLS obtained by leaching a copper-containing source with an acidic leachant, usually sulfuric acid, with an aqueous acidic cupric chloride solution spent printed wire board etchant, to produce an acidic cupric chloride/copper sulfate-containing mixture. This mixture is subjected to SX-EW to recover the copper as copper cathode.

Un procédé pour améliorer la récupération du cuivre et réduire les coûts des matières premières, à partir d'une source contenant du cuivre par un procédé SX-EW. Le procédé comprend les étapes consistant à mélanger un PLS acide contenant du cuivre obtenu par lixiviation d'une source contenant du cuivre avec un lixiviant acide, normalement de l'acide sulfurique avec une solution d'attaque aqueuse d'acides de chlorure cuprique à circuit imprimé, pour produire un mélange contenant un acide de chlorure cuivrique/sulfate de cuivre. Ce mélange est soumis au procédé SX-EW pour récupérer le cuivre sous la forme de cathode de cuivre.

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