H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/20 (2006.01) C01B 31/04 (2006.01) C04B 35/52 (2006.01) C08K 3/04 (2006.01) F25D 17/02 (2006.01) F28D 15/02 (2006.01) F28F 3/02 (2006.01) H01L 23/373 (2006.01) H01L 23/427 (2006.01)
Patent
CA 2482483
An improved cooling system provides cooling away from the surface of electrical and electronic components, by providing an available heat transfer surface area many times greater than that of a convoluted fin structure. The component to be cooled is in thermal contact with a cold plate evaporator device, and a graphite material is associated with the cold plate device. Refrigerant is circulated through the graphite material and the cold plate evaporator device, and the liquid refrigerant is at least partially evaporated by the heat generated by the component. Due to the open nature of the graphite material, the permeability of liquids and vapors is high, allowing for low pressure loss while still maintaining sufficient two phase flow to carry heat away from the electronics.
Marks & Clerk
Thermal Form & Function Inc.
Thermal Form & Function Llc
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