Use of multiple anodes in a magnetron for improving the...

Details Use of multiple anodes in a magnetron for improving the... Use of multiple anodes in a magnetron for improving the...

H - Electricity

01

J

H01J 37/317 (2006.01) C23C 14/54 (2006.01) H01J 37/34 (2006.01) H01L 21/203 (2006.01) H01L 21/31 (2006.01)

Patent

CA 2143777

In one group of embodiments, two or more small anodes are spaced apart from one another in a magnetron, with some aspect of their electrical power being individually controlled in a manner to control a density profile across a plasma. In another group of embodiments, the same effect is obtained by mechanically moving one or more small anodes or anode masks. When used in a magnetron having either a rotating cylindrical cathode or a stationary planar cathode and designed to sputter films of material onto a substrate, the uniformity of the rate of deposition across the substrate is improved. Also, adverse effects of sputtering dielectric materials are reduced.

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