Use of organic acids in low residue solder pastes

Details Use of organic acids in low residue solder pastes Use of organic acids in low residue solder pastes

B - Operations, Transporting

23

K

B23K 35/34 (2006.01) B23K 35/36 (2006.01)

Patent

CA 2063834

2063834 9117858 PCTABS00008 Fluxing compositions are described containing as fluxing agents compounds of formula (I), where R is an electron withdrawing group. Im one embodiment, R is selected from the group consisting of fluorine, chlorine, bromine, iodine, sulfur, hydroxyl, nitrile, and benzyl. The compound cleans oxides from the printed circuit boards (PCBs) under assembly and then volatilize with little or no need for a cleaning step, or cleaning only with water of formic acid. Very little or no undesired residue remains, such acid fluxing agents can be used mixed with typical solder formulations, such as lead/tin solder pastes, or applied topically to solder, such as solder balls; both techniques permit the assembly of PCBs more easily with high quality bonds, and with little or no residue. Malic acid is a preferred organic acid fluxing agent.

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