Use of photosensitive stratum to create through hole...

H - Electricity – 05 – K

Patent

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H05K 3/06 (2006.01) G03F 7/16 (2006.01) G03F 7/28 (2006.01) H05K 3/10 (2006.01) H05K 3/18 (2006.01) H05K 3/42 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1131791

ABSTRACT OF THE DISCLOSURE Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image area, (f) optionally hardening or curing the particulate areas and (g) providing an elec- trically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or con- joining the metallized or catalyzed areas.

321690

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