Use of polyamide as an encapsulating material for...

Details Use of polyamide as an encapsulating material for... Use of polyamide as an encapsulating material for...

H - Electricity

01

L

H01L 31/048 (2006.01) B32B 27/34 (2006.01)

Patent

CA 2684637

The invention relates to the use of polyamide as an encapsulating material for producing photovoltaic modules.

L'invention concerne l'utilisation de polyamide comme matériau d'encapsulation pour la fabrication de modules photovoltaïques.

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