Use of sub-micron copper salt particles in wood preservation

Details Use of sub-micron copper salt particles in wood preservation Use of sub-micron copper salt particles in wood preservation

B - Operations, Transporting

27

K

B27K 3/52 (2006.01) A01N 25/14 (2006.01) A01N 25/26 (2006.01) A01N 59/20 (2006.01) B02C 15/00 (2006.01)

Patent

CA 2591396

A method for preserving wood by injecting into the wood a slurry having: particles of a sparingly soluble copper salt, copper hydroxide, or both, wherein the weight average diameter d50 of the particles in the slurry is between 0.1 microns and 0.7 microns and the d98 of the particles in the slurry is less than about 1 micron; a dispersant; and water. The dispersant is anionic or a mix of anionic and non-ionic. Advantageously, less than 20% by weight of the particles have a diameter less than 20 nanometers. Useful copper salts include basic copper carbonate, tri-basic copper sulfate, copper oxychloride, basic copper nitrate, basic copper borate, copper borate, basic copper phosphate, or copper silicate. The slurry most preferably includes copper hydroxide particles. The slurry further advantageously includes at least one organic biocide, wherein at least a portion of the organic biocide is coated on the particles.

L'invention concerne un procédé destiné à conserver le bois par injection dans celui-ci d'une boue contenant: des particules de sel de cuivre modérément soluble, de l'hydroxyde de cuivre, ou les deux, le diamètre moyen pondéré d50 de particules dans la boue est compris en 0,1 et 0,7 microns et celui de d98 de particules dans la boue inférieur à environ 1 micron; un agent dispersant; et de l'eau. L'agent dispersant est anionique ou consiste en un mélange anionique et non ionique. De façon avantageuse, moins de 20 % en poids des particules possèdent un diamètre inférieur à 20 manomètres. Des sels de cuivre utiles sont notamment le carbonate de cuivre basique, le sulfate de cuivre tribasique, l'oxychlorure de cuivre, le nitrure de cuivre basique, le borate de cuivre basique, le borate de cuivre, le phosphate de cuivre basique ou le silicate de cuivre. La boue comprend idéalement des particules d'hydroxyde de cuivre. Cette boue comprend en outre de façon avantageuse au moins un biocide organique, dans lequel au moins une partie du biocide organique est revêtue sur les particules.

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