C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 77/00 (2006.01) B29C 45/00 (2006.01) C08G 69/14 (2006.01) C08J 5/00 (2006.01) C08K 5/00 (2006.01) C08K 5/3412 (2006.01)
Patent
CA 2491267
The present invention relates to thermoplastic polyamide moulding compositions with reduced or strongly reduced formation of solid deposits and/or coverings during thermoplastic containing at least 20% by weight polyamide and/or at least one copolymer with at least 20% by weight polyamide components, 0.05% by weight up to maximum 3.0% by weight, each related to the total mass of the polyamide matrix-component, at least one compound selected from the group consisting of benzene sulfonic acid alkylamides, o-, p-toluene sulfonic acid alkylamides, alkylhydroxy benzoates, benzoic acid esters, hydroxybenzene carboxylic acid esters, benzene carboxylic acid esters, phthalic acid esters, fatty acid esters, esters of polyhydric alcohols, dicarboxylic acid diesters with a C-number of the acids from 4 to 12 atoms, trialkylmellitic acid esters, phosphoric acid esters, citric acid esters, tetraalkylethylene diamines, tetra (2- hydroxyalkyl) allrylenethylene diamines, fully substituted hydroxyalkyethylene diamines, trialkylamines or fully substituted trialkylethylene diamines and mixtures of the afore mentioned compounds and/or 0,05% by weight up to maximum 3.0% by weight, preferably 0.1% up to 2.0% by weight, more preferably 0.15% by weight up to 1.0%, each related to the total mass of the polyamide matrix-component, at least one aprotic compound selected from the group of N- alkylated, cyclic carbonic acid amides with 5 to 7 ring elements and/or the group of urea derivatives, the alkyl rests of which are linear or branched at the nitrogen and which, if necessary, can contain heteroatoms and heterogroups or which form a linking of the two N- atoms..
Hewel Manfred
Kettl Ralph
Rexin Ornulf
Schmid Eduard
Stoeppelmann Georg
Ems-Chemie Ag
Ridout & Maybee Llp
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