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Patent
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Patent
CA 2416911
A method for improving the line or point-to-point surface contact resistance of an electrically conductive fiber filled polymer composite (10) includes the laser evaporating of a thin polymer layer from the surface (12) of the composite and exposing of the electrically conductive fiber/particle network (14) underneath. The surface of the composite laser is etched to a depth between about 1 to about 250 microns (about 0.001 mm to about 0.250 mm).
Cette invention concerne un procédé propre à améliorer la résistance de contact linéaire ou ponctuelle d'un composite polymère (10) à âme en fibre, électriquement conducteur, consistant à faire évaporer par laser une mince couche polymère sur la surface (12) du composite et d'exposer le réseau de fibres/particules électroconducteurs (14) situé au dessous. La surface du composite est soumise à un gravage par laser sur une profondeur comprise entre environ 1 et environ 250 microns (0,001 mm - 0,250 mm).
Lichtenstein Parker R.
Peng Hong
Parker-Hannifin Corporation
Ridout & Maybee Llp
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