C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/4022, 400/51
C08K 5/00 (2006.01) C08F 2/46 (2006.01) C08F 283/10 (2006.01) C08J 3/28 (2006.01) C08L 101/00 (2006.01) C09D 4/06 (2006.01) C09J 4/06 (2006.01)
Patent
CA 1194637
UV AND THERMALLY CURABLE, THERMOPLASTIC-CONTAINING_ COMPOSITIONS Abstract of the Disclosure A UV and thermally curable composition comprising (1) a member of the group consisting of (a) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: Image wherein R is M or CH3, R1 is an organic moiety and n is at least 2, (b) an epoxy resin containing at least 2 Image groups, and (c) a mixture of (a) and (b); (2) a thermal initiator, (3) a photoinitiator, (41 a thermoplastic material, and (5) a non-polymerizable plasticizer for (4). The exposure of the composition to W radiation and heat in seriatim results in a cured solid product which can be utilized as adhesives, coatings, gaskets, sealants, resists and the like.
418875
Gowling Lafleur Henderson Llp
Grace (w.r.) & Co.
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