V-fold with built in reply envelope

Details V-fold with built in reply envelope V-fold with built in reply envelope

B - Operations, Transporting

65

D

B65D 27/10 (2006.01) B65D 27/06 (2006.01)

Patent

CA 2115011

ABSTRACT OF THE DISCLOSURE A mailer type business form is formed from an intermediate made using a first large quadrate sheet of paper and a second much smaller quadrate sheet. A fold line divides the intermediate into first and second equal size panels, the second panel having a cut out window and the first panel having a second sheet placed over a portion thereof to form a return envelope. A reply address is printed on the second sheet at a portion thereof in alignment with the cut out window when the first sheet is V-folded about the fold line. A repositional adhesive label is applied over the reply address, and the mailer is sealed with adhesive along the edges of the second panel. The mailer is manufactured with a minimum number of operations in a relatively simple manner.

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