Vacuum deposition method

C - Chemistry – Metallurgy – 23 – C

Patent

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204/96.07

C23C 16/44 (2006.01) C23C 14/34 (2006.01)

Patent

CA 1125700

ABSTRACT OF THE DISCLOSURE Metallic coatings are vacuum deposited onto a substrate using more than one deposition method in a single vacuum deposi- tion chamber without breaking vacuum between depositions by providing a vacuum deposition chamber with an RF sputter electrode a chemical vapor deposition assembly spaced from the sputter electrode, and a substrate that can be rotated from beneath the RF sputter electrode to beneath the chemical vapor deposition assembly, then cleaning and degassing the substrate under vacuum in the deposition chamber, then positioning the substrate below the RF sputter electrode, backfilling the chamber with argon, and then sputter depositing a metal coating onto the substrate and then rotating the coated substrate to beneath the chemical vapor depos- ition assembly, Vacuum pumping the chamber, delivering the mater- ial to be chemically vapor deposited to the substrate surface, and heating the substrate to the temperature required for the chemical vapor deposition reaction to take place.

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