Vacuum encapsulation for surface acoustic wave (saw) devices

Details Vacuum encapsulation for surface acoustic wave (saw) devices Vacuum encapsulation for surface acoustic wave (saw) devices

H - Electricity

04

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356/110

H04R 1/02 (2006.01) G10K 11/36 (2006.01) H03H 3/08 (2006.01) H03H 3/10 (2006.01)

Patent

CA 1132719

VACUUM ENCAPSULATION FOR SURFACE ACOUSTIC WAVE (SAW) DEVICES ABSTRACT OF THE DISCLOSURE A surface acoustic wave (SAW) device having a substrate of desired material is vacuum encapsulated in a structure fabricated from the same material as that comprising the substrate. R-2299pw-c

333053

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