C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
C23C 14/56 (2006.01) C23C 16/458 (2006.01) C23C 16/54 (2006.01) C30B 23/06 (2006.01)
Patent
CA 2051214
A vacuum film forming apparatus includes a vacuum vessel the interior of which is divided into a first vacuum chamber and a second vacuum chamber. First evacuating means is arranged for the first vacuum chamber while it is communicated with the first vacuum chamber, and second evacuating means is arranged for the second vacuum chamber while it is communicated with the second vacuum chamber. In addition, a substrate heater is arranged in the first vacuum chamber, and gas supplying means is arranged in the second vacuum chamber. The apparatus further includes a substrate holder for holding a substrate thereon such that a film forming surface of the substrate is oriented toward the second vacuum chamber. The substrate holder is arranged at a position where the first vacuum chamber and the second vacuum chamber are gastightly isolated from each other with the substrate holder interposed therebetween together with the substrate.
Cette invention concerne un appareil de dépôt de couche mince sous vide qui comprend une enceinte sous vide partagée en deux compartiments. Un premier moyen d'évacuation fait le vide dans le premier compartiment lorsqu'il y est raccordé et un second moyen d'évacuation en fait autant dans le second compartiment lorsqu'il y est raccordé. Par ailleurs, le premier compartiment est équipé d'un chauffe-substrat tandis que le second comporte une alimentation en gaz. L'appareil comprend en outre un porte-substrat disposé de telle sorte que la face du substrat devant recevoir la couche mince soit orientée vers le second compartiment. Le porte-substrat est monté à un endroit où il contribue avec le substrat y monté à la séparation parfaitement étanche des deux compartiments.
Aketagawa Ken-Ichi
Murakami Shun-Ichi
Murota Hiroyoshi
Sakai Junro
Tatsumi Toru
Anelva Corporation
Corporation Nec
Kirby Eades Gale Baker
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