Vacuum sputtering apparatus and method

Details Vacuum sputtering apparatus and method Vacuum sputtering apparatus and method

C - Chemistry, Metallurgy

23

C

204/96.09, 204/1

C23C 14/56 (2006.01)

Patent

CA 1059465

ABSTRACT Vacuum sputtering apparatus for treating articles having a housing forming a main vacuum chamber with a plurality of work stations therein. A lock chamber is provided in the main vacuum chamber through which articles can be inserted and removed. Means is provided in the main vacuum chamber for advancing the articles sequentially through the work stations in the main chamber so that as articles are being removed from the lock chambers, articles which have passed through the work stations can be removed from the main vacuum chamber through the lock chamber. In the method articles are introduced into the main vacuum chamber through a lock chamber, and they are intermittently progressively advanced through a plurality of work stations in the main vacuum chamber and then are removed through the lock chamber.

247468

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