Vacuum treating apparatus

Details Vacuum treating apparatus Vacuum treating apparatus

C - Chemistry, Metallurgy

23

C

204/167

C23C 14/56 (2006.01) C23C 14/50 (2006.01)

Patent

CA 1118714

VACUUM TREATING APPARATUS Abstract of the Disclosure The present invention relates to a sputtering apparatus. The apparatus is comprised of a work assembly for holding a workpiece and a sputtering unit which is comprised of a target of sputtering metal. A unit is provided for forming an electrical discharge between the work assembly and the treating unit for causing the metal from the treating unit to be sputtered onto the workpiece. The work assembly and the treating unit are contained within a treatment chamber. A first pump is disposed outside the chamber in communication therewith. A second pump is disposed centrally within the chamber. A unit is provided for selectively isolating the second pump from a portion of the chamber. The work assembly is contained within this portion of the chamber and is disposed in concentric surrounding relation with the second pump. The treating unit is disposed radially outwardly of the work assembly.

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