Valve packing gland pressure sensing by capacitance measurement

Details Valve packing gland pressure sensing by capacitance measurement Valve packing gland pressure sensing by capacitance measurement

G - Physics

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G01L 5/00 (2006.01) F16K 37/00 (2006.01) F16K 41/02 (2006.01) G01L 1/14 (2006.01) G01L 9/12 (2006.01) G06F 17/00 (2006.01)

Patent

CA 2397028

A thin flat disk-like capacitive load sensor of layered sandwich construction having a central opening and a circular outer periphery for installation above a packing follower or.beneath the packing follower or packing gland. The load sensor has a thin first and second insulating outer layer between which an inner layer is secured. The inner layer is formed of dielectric material having a known dielectric constant which will undergo change in its dielectric properties when subjected to compression, a first face having at least one thin electrically conductive circular ring surrounding the central opening in coaxial radially spaced relation, and a second face having a thin electrically conductive circular ring surrounding said central opening in coaxial radially spaced relation. The inner and outer layers contain electrical conductors engaged with respective electrically conductive circular rings on the opposed faces that are adapted to be connected with an electrical measurement apparatus. As the inner layer is compressed the spacing between the electrically conductive rings on the opposed faces is decreased such that compressive force on the packing can be measured as a function of the change in capacitance of the sensor. Proper compression of the packing can be achieved by monitoring during installation. Follow-up sampling or continuous measurement of packing compression provides early detection prior to packing failure to allow corrective action.

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