Vapor deposition routes to nanoporous silica

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H01L 21/316 (2006.01) B05D 3/04 (2006.01) B05D 7/24 (2006.01) C23C 16/40 (2006.01) C23C 18/12 (2006.01) H01L 21/314 (2006.01)

Patent

CA 2336770

A process for the manufacture of nanoporous silica dielectric films by vapor deposition of silica precursors on a substrate. The process provides for vaporizing at least one alkoxysilane composition; depositing the vaporized alkoxysilane composition onto a substrate; exposing the deposited alkoxysilane composition to a water vapor, and either an acid or a base vapor; and drying the exposed alkoxysilane composition, thereby forming a relatively high porosity, low dielectric constant, silicon containing polymer composition on the substrate.

L'invention concerne un procédé servant à fabriquer des films diélectriques en silice nanoporeuse en déposant par évaporation sous vide des précurseurs de silice sur un substrat. Ce procédé consiste à vaporiser au moins une composition alcoxysilane, à déposer sur un substrat cette composition alcoxysilane vaporisée, à exposer la composition alcoxysilane à une vapeur d'eau et à une vapeur acide ou basique, enfin à sécher la composition alcoxysilane ainsi exposée. On obtient ainsi sur le substrat une composition polymère contenant du silicium, présentant une faible constante diélectrique ainsi qu'une porosité relativement élevée.

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