Vertical igfet with internal gate and method of making same

H - Electricity – 01 – L

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356/149

H01L 29/78 (2006.01) H01L 21/336 (2006.01) H01L 29/423 (2006.01)

Patent

CA 1192669

VERTICAL IGFET WITH INTERNAL GATE AND METHOD FOR MAKING SAME Abstract A vertical IGFET device comprising a substantially planar silicon wafer with a source electrode on one major surface and a drain electrode on the opposite major surface is disclosed. An insulated gate electrode, which includes a conductive finger-like portion surrounded by an insulating layer, is internally disposed in the silicon wafer such that a predetermined voltage applied to the gate electrode will regulate a current flow between the source and drain electrodes. The IGFET device is fabricated utilizing an epitaxial lateral overgrowth (ELO) technique for depositing a monocrystalline silicon layer over the insulated gate electrode which is disposed on a silicon substrate.

429823

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