H - Electricity – 01 – P
Patent
H - Electricity
01
P
H01P 5/08 (2006.01)
Patent
CA 2363016
An RF interconnect between an airline circuit including a dielectric substrate (60) having a conductor trace (62) formed on a first substrate surface and an RF circuit (80) separated from the airline circuit by a separation distance. The RF interconnect includes a compressible conductor structure (86) having an uncompressed length exceeding the separation distance, and a dielectric sleeve structure (88) surrounding at least a portion of the uncompressed length of the compressible conductor structure. The RF interconnect structure is disposed between the substrate and the RF circuit such that the compressible conductor is placed under compression between the substrate and the RF circuit. Examples of the RF circuit include a vertical coaxial transmission line or a grounded coplanar waveguide circuit disposed in parallel with the airline circuit.
L'invention concerne une interconnexion RF entre un circuit de ligne aérienne comprenant un substrat diélectrique (60) possédant une impression conductrice (62) formée sur une première surface du substrat et un circuit RF (80) séparé du circuit de ligne aérienne par une distance de séparation. L'interconnexion RF comprend une structure de conducteur compressible (86) possédant une longueur non compressée supérieure à ladite distance de séparation, et une structure de manchon diélectrique (88) recouvrant au moins une partie de la longueur non compressée de la structure de conducteur compressible. La structure de l'interconnexion RF est disposée entre le substrat et le circuit RF de façon que le conducteur compressible soit compressé entre le substrat et le circuit RF. Des exemples du circuit RF comprennent une ligne de transmission coaxiale verticale ou un circuit de guide d'ondes coplanaire mis à la terre disposé en parallèle avec le circuit de ligne aérienne.
Cox Gerald A.
Hubbard Douglas A.
Keesey Timothy D.
Quan Clifton
Roberts David E.
Raytheon Company
Sim & Mcburney
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