Via capacitors within multi-layer 3-dimensional...

Details Via capacitors within multi-layer 3-dimensional... Via capacitors within multi-layer 3-dimensional...

H - Electricity

05

K

H05K 1/16 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2056740

A capacitor structure in a hybrid multilayer circuit having a plurality of insulating layers, the capacitor structure including a dielectric via fill in a via formed in one of the insulating layers, a first conductive element overlying the dielectric via fill, and a second conductive element underlying said dielectric via fill. Each of the first and conductive elements comprises a conductive via fill or a conductive trace.

Affiliated with

Also associated with

Rating

Via capacitors within multi-layer 3-dimensional... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Via capacitors within multi-layer 3-dimensional..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Via capacitors within multi-layer 3-dimensional... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1680227