H - Electricity – 01 – C
Patent
H - Electricity
01
C
H01C 7/00 (2006.01) H01C 7/18 (2006.01) H01L 23/538 (2006.01) H01L 23/64 (2006.01) H05K 1/16 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/40 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2056737
Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One disclosed via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contact- ing predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multi- layer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulat- ing layers, said vias having substantially the same thick- ness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.
Brown Raymond
Mcclanahan Robert F.
Shapiro Andrew A.
Smith Hal D.
Hughes Aircraft Company
Sim & Mcburney
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