Void control in thermoplastics containing silicone...

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B29B 7/88 (2006.01) B29C 47/00 (2006.01) B29C 49/00 (2006.01) C08K 7/04 (2006.01) C08L 101/00 (2006.01)

Patent

CA 1309565

VOID CONTROL IN THERMOPLASTICS CONTAINING SILICONE INTERPENETRATING POLYMER NETWORKS Abstract of the Disclosure Thermoplastic compositions and composites are produced which have fewer and smaller voids with more consistent dimensions compared to conventional unreinforced and fiber reinforced thermoplastics. The high modulus thermoplastic contains silicone semi-interpenetrating polymer networks which are formed by vulcanization within the thermoplastic and initiated during melt processing. Parts molded from the compositions are more homogeneous, with evenly distributed voids, thus reducing the possibility of stress fractures. The compositions are particularly useful in the molding in thick cross-section and variable thickness parts and have been found to have increased thermal stability.

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